TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, TECNISCO have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.
> Insulation type Cu-AlN-Cu submounts
> High pressure seamless microchannels
> Chemically-strengthened glass
> TECNISCO – Products – Mounts Carriers Cooler