TECNISCO

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, TECNISCO have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.

 

http://www.TECNISCO.co.jp/en

 

> CuW submounts

> Insulation type Cu-AlN-Cu submounts

> Mounts / Carriers

> Microchannel cooler

> High pressure seamless microchannels

 

Glass Products:

> Through glass via (TGV)

> Micro-hole glass

> Microfluidic glass

> Cavity glass / Cap glass

> Mesh glass

> Spacer glass

> Chemically-strengthened glass

 

 

Presentations:

TECNISCO Company 

TECNISCO – Products – Mounts Carriers Cooler

TECNISCO – Glass_OPT